Integrated components in the automotive industry and in particular in its electronics must comply with the highest requirements in terms of quality, reliability and cost efficiency.
How can these demands be met in the long term? In the case of electronics, a key factor is the choice of the most suitable depaneling process.
Here, separating with the laser offers significant advantages over conventional processes: technically clean and residue-free cut edges and circuit board surfaces, inimitable precision and flexibility as well as best cost-efficiency – especially in the long term.
Learn more about how you can benefit from these advantages with your own applications.
Born in 1994, Master of Science. Studied industrial engineering with focus on manufacturing technology and technical sales. Master's thesis is in the topic area of digitalization and developed a method for portfolio creation for smart services. He joined LPKF Laser & Electronics AG in 2019 as product manager and is responsible for aligning the stencil and depaneling portfolios with the requirements of the PCB and SMT markets.